AUB ScholarWorks

Statistical methodology for modeling non-IID memory fails events

Show simple item record

dc.contributor.author Francis S.
dc.contributor.author Kanj R.
dc.contributor.author Joshi R.
dc.contributor.author Kayssi A.
dc.contributor.author Chehab A.
dc.contributor.editor
dc.date 2014
dc.date.accessioned 2017-09-07T07:08:30Z
dc.date.available 2017-09-07T07:08:30Z
dc.date.issued 2014
dc.identifier 10.1109/ISQED.2014.6783326
dc.identifier.isbn 9.7814799395e+012
dc.identifier.issn 19483287
dc.identifier.uri http://hdl.handle.net/10938/11990
dc.description.abstract We propose a comprehensive and computationally efficient methodology for the estimation of correlated memory fail probabilities. The methodology allows, for the first time, to accurately predict the number of failing memory parts in the presence of correlation between the memory fails due to shared peripheral logic. It relies on importance sampling to model the fail region and emulate different memory architectures. Unlike traditional yield analysis methodologies that assume independent and identically distributed fail events, we record a high overdispersion rate, variance to mean ratio, due to the correlations. This in turn leads to an increase in the number of memory bit fails compared to IID events and is itself a strong function of the memory-peripheral logic grouping. Under extreme operating conditions, our experiments demonstrate overdispersion ratios larger than 10, and more than 23percent increase in the number of fails at the 90th percentile level of the array samples-population. However, from a redundancy perspective, the correlations result in reduced column redundancy quota requirements with demonstrated cases with more than 20percent reduction in the required quota compared to the IID assumption. © 2014 IEEE.
dc.format.extent
dc.format.extent Pages: (205-211)
dc.language English
dc.publisher IEEE Computer Society;
dc.relation.ispartof Publication Name: Proceedings - International Symposium on Quality Electronic Design, ISQED; Conference Title: 15th International Symposium on Quality Electronic Design, ISQED 2014; Conference Date: 3 March 2014 through 5 March 2014; Conference Location: Santa Clara, CA; Publication Year: 2014; Pages: (205-211);
dc.relation.ispartofseries
dc.relation.uri
dc.source Scopus
dc.subject.other
dc.title Statistical methodology for modeling non-IID memory fails events
dc.type Conference Paper
dc.contributor.affiliation Francis, S., American University of Beirut, Beirut, Lebanon, University of Texas, Austin, United States
dc.contributor.affiliation Kanj, R., American University of Beirut, Beirut, Lebanon
dc.contributor.affiliation Joshi, R., IBM, Yorktown Heights, NY, United States
dc.contributor.affiliation Kayssi, A., American University of Beirut, Beirut, Lebanon
dc.contributor.affiliation Chehab, A., American University of Beirut, Beirut, Lebanon
dc.contributor.authorAddress
dc.contributor.authorCorporate University: American University of Beirut; Faculty: Faculty of Engineering and Architecture; Department: Electrical and Computer Engineering;
dc.contributor.authorDepartment Electrical and Computer Engineering
dc.contributor.authorDivision
dc.contributor.authorEmail
dc.contributor.faculty Faculty of Engineering and Architecture
dc.contributor.authorInitials
dc.contributor.authorOrcidID
dc.contributor.authorReprintAddress
dc.contributor.authorResearcherID
dc.contributor.authorUniversity American University of Beirut
dc.description.cited
dc.description.citedCount
dc.description.citedTotWOSCount
dc.description.citedWOSCount
dc.format.extentCount 7
dc.identifier.articleNo 6783326
dc.identifier.coden
dc.identifier.pubmedID
dc.identifier.scopusID 84899487072
dc.identifier.url
dc.publisher.address
dc.relation.ispartofConference Conference Title: 15th International Symposium on Quality Electronic Design, ISQED 2014 : Conference Date: 3 March 2014 through 5 March 2014 , Conference Location: Santa Clara, CA.
dc.relation.ispartofConferenceCode 104783
dc.relation.ispartofConferenceDate 3 March 2014 through 5 March 2014
dc.relation.ispartofConferenceHosting
dc.relation.ispartofConferenceLoc Santa Clara, CA
dc.relation.ispartofConferenceSponsor IBM;Innovotek;International Society for Quality Electronic Design (ISQED);Mentor Graphics;Silicon Valley Polytechnic Institute;Synopsys
dc.relation.ispartofConferenceTitle 15th International Symposium on Quality Electronic Design, ISQED 2014
dc.relation.ispartofFundingAgency
dc.relation.ispartOfISOAbbr
dc.relation.ispartOfIssue
dc.relation.ispartOfPart
dc.relation.ispartofPubTitle Proceedings - International Symposium on Quality Electronic Design, ISQED
dc.relation.ispartofPubTitleAbbr Proc. - Int. Symp. Qual. Electron. Des., ISQED
dc.relation.ispartOfSpecialIssue
dc.relation.ispartOfSuppl
dc.relation.ispartOfVolume
dc.source.ID
dc.type.publication Series
dc.subject.otherAuthKeyword
dc.subject.otherChemCAS
dc.subject.otherIndex Computationally efficient
dc.subject.otherIndex Operating condition
dc.subject.otherIndex Overdispersion
dc.subject.otherIndex Percentile levels
dc.subject.otherIndex Statistical methodologies
dc.subject.otherIndex Variance-to-mean ratio
dc.subject.otherIndex Yield analysis
dc.subject.otherIndex Computer simulation
dc.subject.otherKeywordPlus
dc.subject.otherWOS


Files in this item

Files Size Format View

There are no files associated with this item.

This item appears in the following Collection(s)

Show simple item record

Search AUB ScholarWorks


Browse

My Account